Shanghai Belling Microelectronics Manufacturing Co., Ltd. on August 13, 2007 to complete the registration, the registered capital of RMB 40 million yuan.Shanghai Belling which invested 30 million yuan (75%), Hong Kong China Sea to its own funds to invest 10 million (25%).Capital increase planned for completion in 2008 steps, two registered capital will be increased to 35,000 yuan.
new company's operating purposes: according to the principle of maximizing shareholder value, the joint venture as the use of advanced technology and scientific management methods, with the design, development, manufacturing (wafer processing), sales of large scale integrated circuit chip capacity of modern enterprise; production on a technical level, quality and price in the domestic and international market competitive products.
new company's strategic positioning: the development of the technology platform for building and "Bei Ling Microelectronics" and the specific customer's product development strategy in close connection with the theme of "Bei Ling Microelectronics' flagship product, launched the strategic process development; the same time for external market customers, improve the technology platform developed market returns.Based on the market to maintain the existing customer demand for technology products, and gradually formed for specific customers with specific technologies.Establish a 6 "main 0.5μm LDMOS, BICMOS and advanced BIPOLAR technology-based analog high-voltage IC process and the 4"-based VDMOS, JFET characteristics and high frequency devices for the process.IDM to establish its own brand and strategic alliances.

operational characteristics
Foundry and domestic production compared to the same type, the main processing products using 2.0 ~ 6.0um Bipolar, 1.2 umCMOS and 1.2 ~ 3.0um BiCMOS, and other unique processing technology.
stable
product performance and quality technical services
better developed technology platform has the ability to

Bipolar technology
CMOS technology
3.0um CMOS gate array technology
BiCMOS technology
EEPROM technology
NMOS technology