Chengdu SHANG Ming industrial co., Ltd. Founded in 1989, is located within the State-level economic and technical district (longquanyi district Longquan Town spirit Starlight road pond Street), covers an area of 25 acres, specialized in semiconductor tooling design and manufacture. after 20 years of development, has formed a set of development and manufacture of professional scale. in 2001, the company passed quality system certification in April 2003 and twice in January 2009 by Sichuan provincial Department of science and technology awarded the "high-tech enterprise".
company die Center Configuration Japan production precision detection device, has United States MOORE and domestic precision coordinates grinder, and Japan production and domestic precision coordinates boring machine, and Switzerland Charmilles and Japan sodick production precision slow thread cutting machine, and Japan sodick precision coordinates EDM machine, and de domestic NC milling machine, and Japan production optical curve grinder, and forming grinder and the Japan production EDM processing machine, and fast go thread cutting processing machine, precision processing device; can provides high precision of semiconductor plastic seal die, and cut gluten cut die, and High speed stamping molds, precision tooling spare parts of various types.
companies based in " honesty, service, respect and development" purposes, in accordance with the "scientific management, strives for realism the innovation, to provide customers with satisfactory products and services," the quality policy, Adhere to the principle of continuous improvement to ensure product quality and customer service, meet the highest requirements of its customers and expectations.
semiconductor die company committed to the research and development, manufacturing and related services. through continuous innovation, accelerate product updates, improve the technology content of products to ensure that the company's leadership in domestic packaging mould, seize the opportunity of China's entry into WTO, strengthen cooperation with domestic and international advanced packaging enterprises in colleges and universities, improving the competitiveness of enterprises and international market share, with the development of microelectronics industry and continue to grow.