Company Introduction - Ningbo Kangqiang Electronics Co., Ltd. - Cardofcom
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Company Introduction

Ningbo Kangqiang Electronics Co., Ltd. (stock code: 002119 ), at 2007 years 3 month 2 listed on the Shenzhen Stock Exchange, Total equity 9710 million, total assets 8.5 million and net assets 5.3 million. 2006 annual sales 6.3 million, net profit 4236 million.

company specializing in the production of semiconductor packaging materials:

1 , the lead frame: frame, including integrated circuits, frame and power electronic devices, surface mount components, frameworks and < FONT face = "Times New Roman"> TO-92 , TO-3P framework such as discrete devices, production scale ranks the eleventh consecutive year the first domestic counterparts , capacity 250 one hundred million;

2 , bonding wire: including bonding wire, capacity 3 t; the only mass production of copper wire bonding performance indicators over imported products, 07 at the end of production capacity will reach 1 ton.

3 , a smart card IC Tape: domestic initiative, the company independently design and manufacture a wide exposure, etching lines, production samples to user requirements, and passed the information industry development fund and acceptance. The success of product research and development production of lead frame etching, IC set with flexible printed circuit boards and other items to create the conditions.

4 , alloy wire materials: 07 in new product development, Nissan has introduced automatic wire rod working machine 3 Taiwan during the year to achieve 21 units, annual 1500 ton. Alloy wire, including wire cutting copper alloy, plans to develop multiple sets of crystals with cutting line slicer, can improve solar cells, integrated circuits and other semiconductor chip production efficiency and yield.

company 2001 was named the National Key high-tech enterprises, 1996 years have passed since ISO9001 , ISO14001 , QS-9000 and other system certification. 2005 was named China's support for the semiconductor industry's most influential business, 2006 is in copper wire bonding as the first Chinese semiconductor innovation. 2006 , the company approved by the Provincial Science and Technology to set up provincial engineering technology research center.

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